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2EDL05I06BFXUMA1 - Infineon

Description: Gate Drivers 600V high & low-side 0.7A,integrated BSD

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2EDL05I06BFXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - P-DSO-8
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2EDL05I06BFXUMA1 Details

  • Manufacturer Part Number:

    2EDL05I06BFXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.7 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    7 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SOI

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.59 µs

  • Turn-on Time:

    0.61 µs

  • Width:

    3.9 mm

2EDL05I06BFXUMA1 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good airflow around the component.
  • To ensure EMC, follow Infineon's guidelines for PCB layout, use a shielded enclosure, and implement proper filtering and shielding techniques. Additionally, consider using a common-mode choke and TVS diodes to reduce electromagnetic interference.
  • The 2EDL05I06BFXUMA1 is designed to meet high reliability standards. According to Infineon, it has a typical lifetime of 15 years at a junction temperature of 150°C. However, actual lifetime may vary depending on operating conditions, thermal management, and other factors.
  • The 2EDL05I06BFXUMA1 is rated for operation up to 150°C junction temperature. However, it's essential to consider the device's thermal derating, and ensure proper heat sinking and thermal management to prevent overheating.
  • For troubleshooting, refer to Infineon's application notes and datasheet. Use oscilloscopes and logic analyzers to monitor signals and identify issues. Also, consider using Infineon's development boards and evaluation kits to simplify the debugging process.

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