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2EDN7534RXTMA1 - Infineon

Description: EiceDRIVER™ 2EDN Gate Driver for MOSFETs and WBG switches

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2EDN7534RXTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSSOP-8-1
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2EDN7534RXTMA1 - Infineon  - 3D model - Small Outline Packages - PG-TSSOP-8-1
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2EDN7534RXTMA1 Details

  • Manufacturer Part Number:

    2EDN7534RXTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.04 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.025 µs

  • Turn-on Time:

    0.025 µs

  • Width:

    3 mm

2EDN7534RXTMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal management guidelines for the 2EDN7534RXTMA1. It's essential to follow these guidelines to ensure optimal performance, reliability, and to prevent thermal-related issues.
  • When selecting a gate driver for the 2EDN7534RXTMA1, consider factors such as the driver's output current capability, voltage rating, and propagation delay. Infineon recommends using their EiceDRIVER™ gate driver family, which is specifically designed to work with their IGBT modules. The EiceDRIVER™ 1EDC20I12BA, for example, is a suitable option for the 2EDN7534RXTMA1.
  • Paralleling multiple 2EDN7534RXTMA1 modules can be done to achieve higher current ratings, but it requires careful consideration of the module's internal layout, thermal management, and gate drive circuitry. Infineon provides guidelines for paralleling their IGBT modules in their application note (AN2014-01). It's essential to ensure that the modules are properly synchronized, and the gate drive circuitry is designed to handle the increased current requirements.
  • To protect the 2EDN7534RXTMA1 from overvoltage and overcurrent conditions, consider implementing overvoltage protection (OVP) and overcurrent protection (OCP) circuits. Infineon recommends using their TRENCHSTOP™ IGBT modules with built-in OVP and OCP features. Additionally, designers can use external protection circuits, such as voltage clamps and current sensors, to detect and respond to fault conditions.
  • The 2EDN7534RXTMA1 is designed to operate in high-temperature and high-stress applications. Infineon provides reliability data and lifetime expectations for their IGBT modules in their datasheets and application notes. Designers should consider factors such as junction temperature, switching frequency, and power cycling when estimating the module's lifetime. Infineon also offers simulation tools and models to help designers predict the module's behavior under various operating conditions.

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