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2EDN8523FXTMA1 - Infineon

Description: INFINEON - 2EDN8523FXTMA1 - MOSFET Driver, Low Side, 4.5 V to 20 V Supply, 5 A Peak Out, 19 ns In/19 ns Out Delay, DSO-8

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2EDN8523FXTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-60
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3D Models
2EDN8523FXTMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-60
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2EDN8523FXTMA1 Details

  • Manufacturer Part Number:

    2EDN8523FXTMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.023 µs

  • Turn-on Time:

    0.023 µs

  • Width:

    3.94 mm

2EDN8523FXTMA1 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good airflow around the device.
  • To ensure EMC, follow Infineon's guidelines for PCB layout, use a shielded enclosure, and implement proper filtering and shielding techniques. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated.
  • The 2EDN8523FXTMA1 is designed to meet high reliability standards. According to Infineon, the device has a typical lifetime of 15 years or more, depending on operating conditions. However, it's essential to follow proper storage, handling, and operating procedures to ensure maximum reliability.
  • The 2EDN8523FXTMA1 is rated for operation up to 150°C. However, it's essential to consider the device's power dissipation, thermal resistance, and cooling mechanisms when operating in high-temperature environments. Consult Infineon's application notes and thermal management guidelines for more information.
  • To troubleshoot and debug issues, use a systematic approach, checking power supply, input signals, and output signals. Utilize Infineon's application notes, datasheets, and development tools, such as simulation models and evaluation boards, to aid in the debugging process.

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2EDN8523FXTMA1 Overview

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