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2EDS8165HXUMA1 - Infineon

Description: Gate Drivers DRIVER IC

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2EDS8165HXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-16-30
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2EDS8165HXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-16-30
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2EDS8165HXUMA1 Details

  • Manufacturer Part Number:

    2EDS8165HXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • Country Of Origin:

    Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.75

  • Additional Feature:

    ALSO OPERATES WITH OUTPUT SUPPLY VOLTAGE VDDA 4.5 TO 20

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    8 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    3.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.044 µs

  • Turn-on Time:

    0.044 µs

  • Width:

    7.5 mm

2EDS8165HXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Infineon provides EMC guidelines in their application note AN2013-02, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference.
  • Infineon recommends soldering conditions of 260°C for 10 seconds, with a peak temperature of 265°C. Refer to the Infineon soldering guide for more information.
  • Infineon recommends storing the device in its original packaging, away from direct sunlight and moisture. Avoid bending, flexing, or applying excessive force to the device during handling and shipping.
  • The 2EDS8165HXUMA1 is manufactured according to Infineon's quality and reliability standards, which include ISO/TS 16949 and AEC-Q100. Refer to the Infineon quality and reliability report for more information.

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2EDS8165HXUMA1 Overview

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