2SA1943-O footprint, schematic symbol and 3D model by Toshiba

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PCB Footprints

2SA1943-O - Toshiba PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - 2-21F1A_

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3D Models

2SA1943-O - Toshiba - 3D model - Transistor Outline, Vertical - 2-21F1A_

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Datasheet Download Datasheet
Stock & Prices Price & Stock for 2SA1943-O
Part Number 2SA1943-O
Manufacturer Toshiba
Pin Count 3
Part Category Transistor
Package Category Transistor Outline, Vertical
Footprint Name Transistor Outline, Vertical - 2-21F1A_
Released Date Apr 2, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

2SA1943-O Details

Manufacturer Part Number:
2SA1943-O
Pbfree Code:
No
Rohs Code:
No
Part Life Cycle Code:
Active
Package Description:
LEAD FREE, 2-21F1A, 3 PIN
Pin Count:
3
Reach Compliance Code:
Unknown
ECCN Code:
EAR99
HTS Code:
8541.29.00.95
Factory Lead Time:
16 Weeks
Manufacturer:
Toshiba America Electronic Components
YTEOL:
3
Case Connection:
COLLECTOR
Collector Current-Max (IC):
15 A
Collector-Emitter Voltage-Max:
230 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
80
JESD-30 Code:
R-PSFM-T3
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity/Channel Type:
PNP
Power Dissipation Ambient-Max:
150 W
Power Dissipation-Max (Abs):
150 W
Qualification Status:
Not Qualified
Surface Mount:
NO
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Transistor Application:
AMPLIFIER
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
30 MHz
VCEsat-Max:
3 V

2SA1943-O Frequently Asked Questions (FAQs)

The recommended PCB footprint for the 2SA1943-O is a standard TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
Yes, the 2SA1943-O can be used in switching regulator applications, but it's essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range of 100 kHz to 500 kHz.
To handle thermal management, ensure good thermal contact between the device and the heat sink, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and maintain a maximum junction temperature (Tj) of 150°C.
Yes, the 2SA1943-O is compatible with lead-free soldering processes, but it's essential to follow the recommended soldering temperature profile and ensure that the peak soldering temperature does not exceed 260°C.
The recommended storage temperature range for the 2SA1943-O is -40°C to 125°C, and it's essential to store the devices in a dry, clean environment to prevent moisture absorption.

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2SA1943-O Overview

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2SA1943-O - Toshiba

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