ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
ROHM recommends derating the power dissipation according to the temperature derating curve in the datasheet. Additionally, ensure good thermal design, and consider using a heat sink or thermal interface material if necessary.
ROHM recommends a soldering profile with a peak temperature of 260°C, and a dwell time of 10-30 seconds. The component should be soldered using a solder with a melting point of 217°C or higher.
Yes, the 2SAR372P5T100Q is designed to withstand vibrations up to 10G. However, it's recommended to follow ROHM's guidelines for vibration testing and ensure proper PCB design and assembly to minimize the risk of mechanical stress.
ROHM recommends following standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the components in ESD-protective packaging. The component itself has an ESD protection rating of 2kV human body model.
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2SAR372P5T100Q Overview
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