ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
The 2SAR562F3TR requires a stable input voltage (VCC) and a proper biasing circuit to ensure optimal performance. A decoupling capacitor (e.g., 10uF) should be placed close to the VCC pin, and a bias resistor (e.g., 1kΩ) should be used to set the desired output voltage.
The maximum power dissipation for the 2SAR562F3TR is 1.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB. ROHM recommends following the thermal derating curve provided in the datasheet to ensure safe operation.
Yes, the 2SAR562F3TR is qualified for automotive and high-reliability applications. ROHM provides a dedicated automotive grade (AEC-Q100) and a high-reliability grade (ISO 9001) for this device, which ensures it meets the required standards for these applications.
The 2SAR562F3TR is sensitive to electrostatic discharge (ESD). To prevent damage, ROHM recommends following proper ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD bag during handling and assembly. The device should also be stored in an ESD-protected environment.
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2SAR562F3TR Overview
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