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2SC2625 - FUJI ELECTRIC

Description: TRIPLE DIFFUSED PLANER TYPE HIGH VOLTAGE,HIGH SPEED SWITCHING

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PCB Footprints
2SC2625 - FUJI ELECTRIC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - SC-65_2024
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3D Models
2SC2625 - FUJI ELECTRIC  - 3D model - Transistor Outline, Vertical - SC-65_2024
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2SC2625 Details

  • Manufacturer Part Number:

    2SC2625

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-3P

  • Package Description:

    SC-65, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Fuji Electric Co Ltd

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    10 A

  • Collector-Emitter Voltage-Max:

    400 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    10

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    80 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

2SC2625 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the 2SC2625 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to consult with Fuji Electric Co Ltd or a qualified engineer for specific guidance.
  • To ensure the 2SC2625 is properly biased, follow the recommended biasing conditions outlined in the datasheet, and consider the following: 1) ensure the base-emitter voltage (Vbe) is within the recommended range, 2) maintain a stable collector-emitter voltage (Vce), and 3) provide adequate heat sinking to prevent thermal runaway. Additionally, consider using a biasing circuit that provides a stable current source and voltage reference.
  • For optimal thermal performance, it's recommended to use a PCB layout that provides good thermal conduction and minimizes thermal resistance. This can be achieved by: 1) using a thick copper PCB, 2) placing the transistor close to a heat sink or thermal pad, 3) using thermal vias to dissipate heat, and 4) ensuring good airflow around the device. Consult with a qualified engineer or Fuji Electric Co Ltd for specific guidance on PCB layout and thermal management.
  • To protect the 2SC2625 from electrostatic discharge (ESD), follow proper handling and storage procedures: 1) handle the device by the body, not the leads, 2) use an anti-static wrist strap or mat, 3) store the device in an anti-static bag or container, and 4) ensure the PCB and assembly process are ESD-safe. Additionally, consider using ESD protection devices, such as TVS diodes or ESD arrays, in the circuit design.
  • The reliability and lifespan expectations for the 2SC2625 depend on various factors, including operating conditions, environmental factors, and manufacturing quality. As a general guideline, the 2SC2625 is designed to meet the reliability standards of Fuji Electric Co Ltd, which typically exceed industry standards. However, it's recommended to consult with Fuji Electric Co Ltd or a qualified engineer for specific guidance on reliability and lifespan expectations.

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2SC2625 Overview

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