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2SC2837 - SANKEN ELECTRIC CO.

Description: TRANS NPN 150V 10A TO-3P

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PCB Footprints
2SC2837 - SANKEN ELECTRIC CO. PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO3P-3L-ren1
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3D Models
2SC2837 - SANKEN ELECTRIC CO.  - 3D model - Transistor Outline, Vertical - TO3P-3L-ren1
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2SC2837 Details

  • Manufacturer Part Number:

    2SC2837

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-3P

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Sanken Electric Co Ltd

  • YTEOL:

    0

  • Collector Current-Max (IC):

    10 A

  • Collector-Emitter Voltage-Max:

    150 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    140 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    100 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    70 MHz

2SC2837 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the 2SC2837 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general rule, it's recommended to operate the device within 70-80% of its maximum ratings to ensure reliability.
  • To ensure proper biasing, follow the recommended biasing circuit and component values provided in the datasheet. Additionally, consider the device's current gain (hFE) and base-emitter voltage (VBE) when designing the biasing circuit. It's also important to ensure the device is operated within its recommended operating conditions.
  • For optimal thermal management, ensure good heat dissipation by using a heat sink or thermal pad, and follow recommended PCB layout guidelines for power devices. Keep the device away from heat sources and ensure good airflow. A well-designed PCB layout can help reduce thermal resistance and improve overall device reliability.
  • Yes, the 2SC2837 can be used in switching applications, but it's essential to consider the device's switching characteristics, such as turn-on and turn-off times, and ensure the device is operated within its recommended switching frequency range. Additionally, consider the device's power dissipation and thermal management during switching operations.
  • To protect the 2SC2837 from ESD and overvoltage, follow proper handling and storage procedures, and use ESD protection devices such as TVS diodes or zener diodes in the circuit design. Additionally, consider using overvoltage protection circuits and ensure the device is operated within its recommended voltage ratings.

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2SC2837 Overview

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