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2SC3264 - SANKEN ELECTRIC CO.

Description: TRANS NPN 230V 17A MT200

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PCB Footprints
2SC3264 - SANKEN ELECTRIC CO. PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - MT-200_2024
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3D Models
2SC3264 - SANKEN ELECTRIC CO.  - 3D model - Transistor Outline, Vertical - MT-200_2024
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2SC3264 Details

  • Manufacturer Part Number:

    2SC3264

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MT-200, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Date Of Intro:

    1990-05-23

  • Manufacturer:

    Sanken Electric Co Ltd

  • YTEOL:

    0

  • Collector Current-Max (IC):

    17 A

  • Collector-Emitter Voltage-Max:

    230 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    200 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    60 MHz

2SC3264 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the 2SC3264 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general rule, it's recommended to operate the device within 70-80% of its maximum ratings to ensure reliability.
  • To ensure proper biasing, follow the recommended biasing circuit and component values provided in the datasheet. Additionally, consider the device's current gain (hFE) and base-emitter voltage (VBE) when designing the biasing circuit. It's also important to ensure the device is operated within its recommended operating conditions.
  • For optimal thermal management, ensure the 2SC3264 is mounted on a heat sink with a thermal resistance of 1°C/W or lower. Use a PCB layout that minimizes thermal resistance and ensures good heat dissipation. A recommended layout is to place the device near a heat sink or a metal plate, and use thermal vias to dissipate heat.
  • Yes, the 2SC3264 can be used in switching applications. However, consider the device's switching characteristics, such as turn-on and turn-off times, and ensure the device is operated within its recommended switching frequency range. Additionally, consider the device's power dissipation and thermal management when designing the switching circuit.
  • To protect the 2SC3264 from ESD, follow proper handling and storage procedures, such as using anti-static bags or containers, and grounding yourself before handling the device. In the circuit design, consider adding ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage from electrostatic discharge.

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