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2SCR582D3TL1 - ROHM Semiconductor

Description: NPN, TO-252 (DPAK), 30V 10A, Power Transistor

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2SCR582D3TL1 - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
2SCR582D3TL1 - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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2SCR582D3TL1 Details

  • Manufacturer Part Number:

    2SCR582D3TL1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-12-20

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    10 A

  • Collector-Base Capacitance-Max:

    85 pF

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    10 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

  • VCEsat-Max:

    0.35 V

2SCR582D3TL1 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to maintain a safe junction temperature. Monitor the device's thermal resistance and power dissipation to prevent overheating.
  • Handle the device by the body, avoiding touching the leads or pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions during handling and assembly.
  • Yes, the 2SCR582D3TL1 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within the recommended operating conditions and follows the application notes for reliable operation.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check the device's operating conditions, power supply, and PCB layout for any anomalies. Use oscilloscopes or logic analyzers to debug the circuit and identify the root cause of the issue.

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2SCR582D3TL1 Overview

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