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2SD300C17A3 - Power Integrations

Description: Gate Drivers Dual-Ch SCALE-2 30A 4W Up to 1700V 14V ~ 16V,30A, 30A,-40°C ~ 85°C (TA)

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PCB Footprints
2SD300C17A3 - Power Integrations PCB footprint - Other - Other - 2SD300C17A3-4
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3D Models
2SD300C17A3 - Power Integrations  - 3D model - Other - 2SD300C17A3-4
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2SD300C17A3 Details

  • Manufacturer Part Number:

    2SD300C17A3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Power Integrations

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    14 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Temperature Grade:

    INDUSTRIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

2SD300C17A3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the 2SD300C17A3 should include a solid ground plane, a separate layer for the high-current paths, and a thermal relief pattern on the drain pin to improve heat dissipation. A 2-ounce copper layer is recommended for the PCB.
  • To ensure reliable start-up and shutdown, make sure to follow the recommended soft-start and shutdown procedures outlined in the datasheet. This includes using a soft-start circuit to limit the inrush current and a shutdown circuit to prevent voltage spikes.
  • When designing an EMI filter for the 2SD300C17A3, critical components to consider include the input filter capacitor, the common-mode choke, and the output filter capacitor. These components should be selected based on the specific application requirements and the frequency range of interest.
  • To optimize the 2SD300C17A3 for high-efficiency operation, focus on minimizing losses in the device. This can be achieved by optimizing the transformer design, using a low-loss core material, and minimizing the primary and secondary winding resistances. Additionally, ensure that the device is operated within its recommended operating conditions.
  • Key considerations for thermal management of the 2SD300C17A3 include ensuring good thermal contact between the device and the heat sink, using a heat sink with a high thermal conductivity, and providing adequate airflow to dissipate heat. The device's thermal pad should be connected to a solid ground plane to improve heat dissipation.

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2SD300C17A3 Overview

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