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2SEPC820MX+TSS - Panasonic

Description: Panasonic 820µF 2.5V dc Aluminium Electrolytic Capacitor, Through Hole 8 x 9mm +105°C 8mm 3.5mm 9mm

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2SEPC820MX+TSS - Panasonic - PCB symbol
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PCB Footprints
2SEPC820MX+TSS - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - E9
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3D Models
2SEPC820MX+TSS - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - E9
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2SEPC820MX+TSS Details

  • Manufacturer Part Number:

    2SEPC820MX+TSS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ TO 300KHZ

  • Capacitance:

    820 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    8 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    7 mΩ

  • Leakage Current:

    0.5 mA

  • Length:

    9 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    AMMO PACK

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    2.5 V

  • Ripple Current:

    305 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.1

  • Terminal Pitch:

    3.5 mm

  • Terminal Shape:

    WIRE

2SEPC820MX+TSS Frequently Asked Questions (FAQs)

  • Panasonic recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal pad on the bottom of the package should be connected to a heat sink or a thermal plane on the PCB.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Panasonic's recommended derating guidelines for the device. This includes reducing the operating voltage and current as temperature increases. Additionally, ensure proper thermal management and consider using a heat sink or thermal interface material to reduce junction temperature.
  • Panasonic recommends a peak reflow temperature of 260°C (500°F) with a dwell time of 30 seconds to 60 seconds. The recommended soldering process is a reflow soldering process with a nitrogen atmosphere. Hand soldering is not recommended due to the component's small size and high pin count.
  • The 2SEPC820MX+TSS is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Store the components in a dry, nitrogen-filled package or a moisture barrier bag. Before soldering, bake the components at 125°C (257°F) for 24 hours to remove any absorbed moisture.
  • To minimize EMI and noise, Panasonic recommends using a shielded cable or a twisted pair for the input and output connections. Keep the input and output traces as short as possible and away from noise sources. Use a common-mode choke or a ferrite bead to filter out high-frequency noise. Additionally, consider using a ground plane or a shield layer on the PCB to reduce radiation.

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2SEPC820MX+TSS Overview

Use the download button to access the 2SEPC820MX+TSS schematic symbol, PCB footprint, and 3D model.
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