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2SK2515-A - Renesas Electronics

Description: The 2SK2515 is a Switching N Channel MOSFET.

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2SK2515-A - Renesas Electronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-3P (MP-88)_
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3D Models
2SK2515-A - Renesas Electronics  - 3D model - Transistor Outline, Vertical - TO-3P (MP-88)_
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2SK2515-A Details

  • Manufacturer Part Number:

    2SK2515-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MP-88

  • Package Description:

    TO-3P, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    PRSS0004ZS

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    50 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-609 Code:

    e6

  • Number of Elements:

    1

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    150 W

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN BISMUTH

  • Time@Peak Reflow Temperature-Max (s):

    10

2SK2515-A Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 2SK2515-A is -40°C to 150°C, although it can withstand storage temperatures from -55°C to 175°C.
  • To ensure proper biasing, the 2SK2515-A requires a gate-source voltage (Vgs) between 2V and 10V, and a drain-source voltage (Vds) between 10V and 500V. Additionally, the gate current (Ig) should be limited to 10mA or less.
  • The maximum allowable power dissipation for the 2SK2515-A is 125W, although this can be increased to 250W with proper heat sinking and thermal management.
  • To protect the 2SK2515-A from ESD, handle the device with anti-static wrist straps, mats, or bags, and avoid touching the pins or leads. Additionally, ensure that the device is stored in a conductive container or bag when not in use.
  • For optimal thermal management, use a multi-layer PCB with a large copper area for heat dissipation, and ensure good thermal conductivity between the device and the heat sink. Additionally, use a low-ESR capacitor and a high-current rating for the power supply lines.

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2SK2515-A Overview

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