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2SK3703-1E - onsemi

Description: MOSFET NCH 4V DRIVE SERIES

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2SK3703-1E - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220F-3 SG 2SK3703-1E
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2SK3703-1E - onsemi  - 3D model - Transistor Outline, Vertical - TO-220F-3 SG 2SK3703-1E
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2SK3703-1E Details

  • Manufacturer Part Number:

    2SK3703-1E

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-220F-3SG, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    221AT

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    135 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.04 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    197 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    2 W

  • Power Dissipation-Max (Abs):

    25 W

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

2SK3703-1E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 2SK3703-1E is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended biasing circuit and voltage levels outlined in the datasheet, and ensure that the device is operated within the recommended operating conditions.
  • For optimal thermal performance, use a multi-layer PCB with a thermal relief pattern, and ensure good thermal conductivity between the device and the heat sink. Follow the recommended PCB layout guidelines in the datasheet.
  • Use ESD protection devices such as TVS diodes or ESD arrays in conjunction with proper PCB layout and handling practices to prevent ESD damage to the device.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or die. Follow the recommended storage and handling procedures outlined in the datasheet.

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