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3.0SMCJ10A - LITTELFUSE

Description: ESD Suppressors / TVS Diodes TVS 3KW 10V 5%UNI DO-214AB TR13 RoHS

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Symbol
3.0SMCJ10A - LITTELFUSE - PCB symbol
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PCB Footprints
3.0SMCJ10A - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AB (SMC J-Bend)_2021
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3D Models
3.0SMCJ10A - LITTELFUSE - 3D model - Diodes Moulded - DO-214AB (SMC J-Bend)_2021
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3.0SMCJ10A Details

  • Manufacturer Part Number:

    3.0SMCJ10A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7.66

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    12.3 V

  • Breakdown Voltage-Min:

    11.1 V

  • Breakdown Voltage-Nom:

    11.7 V

  • Clamping Voltage-Max:

    17 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Reference Standard:

    IEC-61000-4-2, 4-4; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    10 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

3.0SMCJ10A Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3.0SMCJ10A can be found in the Littelfuse application note 'Surface Mount Land Pattern and Stencil Recommendations' (document number: 10101).
  • To ensure reliability in high-temperature applications, it is recommended to derate the device's voltage and current ratings according to the temperature derating curve provided in the datasheet. Additionally, ensure proper thermal management and consider using a heat sink if necessary.
  • The 3.0SMCJ10A is designed for low-frequency applications. While it can be used in high-frequency applications, its performance may be affected. It is recommended to consult with a Littelfuse application engineer to determine the suitability of the device for high-frequency applications.
  • The recommended soldering profile for the 3.0SMCJ10A is a peak temperature of 260°C (500°F) for a maximum of 10 seconds. It is recommended to follow the IPC J-STD-020D standard for soldering surface mount devices.
  • Yes, the 3.0SMCJ10A is compatible with lead-free soldering processes. It is RoHS compliant and meets the requirements of the EU's Restriction of Hazardous Substances (RoHS) directive.

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3.0SMCJ10A Overview

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