Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
While the 3250W-1-253 has an operating temperature range of -40°C to +125°C, it's essential to consider the derating curve for high-temperature applications. Consult with Bourns' application engineers for specific guidance on temperature derating and thermal management.
Bourns provides EMI shielding options for the 3250W-1-253. Consult with their application engineers to determine the best EMI shielding solution for your specific application. Additionally, ensure proper PCB layout, grounding, and shielding to minimize EMI.
Bourns recommends a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. Ensure the soldering process meets the IPC J-STD-020 standard for through-hole components.
The 3250W-1-253 is designed to withstand moderate vibration levels. However, for high-vibration applications, consider using additional mechanical support or potting the component to ensure reliability. Consult with Bourns' application engineers for specific guidance.
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3250W-1-253 Overview
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