Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure proper thermal management, minimize parasitic inductance, and optimize performance.
To minimize electromagnetic interference (EMI), keep the inductor at least 5 mm away from sensitive components. You can also use shielding techniques, such as copper tape or mu-metal shielding, to contain the magnetic field.
While the datasheet specifies a maximum rated voltage, it's essential to consider the voltage stress during transient events, such as inrush current or voltage spikes. As a general rule, keep the voltage stress below 1.5 times the rated voltage to ensure reliability.
The SRF is typically not specified in the datasheet, but you can estimate it using the inductor's inductance and capacitance values. The SRF can affect the inductor's impedance and may cause resonant peaks in your circuit. Use simulation tools or consult with a Bourns application engineer to determine the SRF and its impact on your design.
The inductor's thermal resistance (Rth) is specified in the datasheet. Ensure good thermal conductivity between the inductor and the PCB by using thermal vias, thermal pads, or thermal interface materials. This helps to dissipate heat and prevent thermal runaway.
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