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34AA02T-I/MNY - Microchip

Description: EEPROM 2K 256X8 1.8V SERIAL EE IND 2K I2C™ Serial EEPROM Software Write-Protect

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PCB Footprints
34AA02T-I/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-LEAD TDFN
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3D Models
34AA02T-I/MNY - Microchip  - 3D model - Small Outline No-lead - 8-LEAD TDFN
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34AA02T-I/MNY Details

  • Manufacturer Part Number:

    34AA02T-I/MNY

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDDR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Memory Density:

    2048 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    256 words

  • Number of Words Code:

    256

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256X8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.5 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE/SOFTWARE

34AA02T-I/MNY Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 34AA02T-I/MNY is -40°C to +125°C.
  • The 34AA02T-I/MNY has an internal POR and BOR circuitry. The POR ensures the device resets properly during power-up, and the BOR resets the device when the supply voltage falls below a certain threshold. No external components are required to handle POR and BOR.
  • The recommended storage temperature range for the 34AA02T-I/MNY is -65°C to +150°C.
  • Yes, the 34AA02T-I/MNY is designed to operate in high-vibration environments. However, it's essential to follow proper mounting and soldering techniques to ensure the device's reliability.
  • To implement a reliable write cycle, ensure that the device is powered with a stable voltage source, and the write cycle is performed within the specified timing parameters. Also, use the device's built-in write protection features, such as the WP pin, to prevent accidental writes.

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34AA02T-I/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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