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36273225154R7M - TE Connectivity

Description: 4.7 µH Power Inductor, 650 mA, .195 Ω DC Resistance, 20 %, Length .125 in [3.2 mm], Width 2.5 mm [.098 in], Height 1.55 mm [.061 in], Sigma 3627

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36273225154R7M - TE Connectivity PCB footprint - Other - Other - 36273225154R7M
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36273225154R7M Details

  • Manufacturer Part Number:

    36273225154R7M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    6.8

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.195 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.55 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, 7 INCH

  • Rated Current-Max:

    0.65 A

  • Self Resonance Frequency:

    43 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

36273225154R7M Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides, which can be found on their website or through their customer support. It's essential to follow these guidelines to ensure proper assembly and reliability.
  • The 36273225154R7M is a moisture-sensitive device (MSD). It's crucial to follow the recommended storage and handling procedures outlined in the JEDEC standard J-STD-033C to prevent damage. This includes storing the components in a dry environment, using desiccant packaging, and following a controlled humidity reflow soldering process.
  • The recommended reflow soldering temperature profile for the 36273225154R7M can be found in the TE Connectivity datasheet or application notes. Typically, the peak temperature should not exceed 260°C, and the total time above 220°C should not exceed 60 seconds. It's essential to follow these guidelines to prevent component damage or degradation.
  • Yes, the 36273225154R7M may require specific cleaning or washing procedures to remove flux residues or other contaminants. TE Connectivity recommends following the IPC-J-STD-001 guidelines for cleaning and washing electronic assemblies. It's essential to use a cleaning process that is compatible with the component's materials and construction.
  • To ensure the component's reliability and performance, it's essential to follow the recommended operating conditions, including temperature, voltage, and current ratings. Additionally, designers should consider the component's thermal management, power derating, and potential thermal stress during the design process.

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36273225154R7M Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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