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39-29-6068 - Molex

Description: Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 2 Circuits, without Snap-in Plastic Peg PCB Lock

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PCB Footprints
39-29-6068 - Molex PCB footprint - Other - Other - 39-29-6068
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3D Models
39-29-6068 - Molex  - 3D model - Other - 39-29-6068
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39-29-6068 Details

  • Manufacturer Part Number:

    39-29-6068

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mexico, Puerto Rico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    6.87

  • Connector Type:

    RECTANGULAR POWER CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Matte Tin (Sn)

  • Contact Material:

    BRASS

  • DIN Conformance:

    NO

  • IEC Conformance:

    NO

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

39-29-6068 Frequently Asked Questions (FAQs)

  • The recommended mating cycle for the Molex 39296068 connector is 50 cycles, as per Molex's application notes.
  • The operating temperature range for the Molex 39296068 connector is -40°C to 105°C, as per the datasheet.
  • Yes, the Molex 39296068 connector is designed to withstand high-vibration applications, with a vibration rating of 10G, 10-2000Hz, as per Molex's testing standards.
  • The recommended torque for the screw terminals on the Molex 39296068 connector is 0.5 Nm to 1.5 Nm, as per Molex's application notes.
  • Yes, the Molex 39296068 connector is designed to be compatible with automated assembly processes, including pick-and-place machines.

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39-29-6068 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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