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39281183 - Molex

Description: Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 18 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural

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Symbol
39281183 - Molex - PCB symbol
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PCB Footprints
39281183 - Molex PCB footprint - Other - Other - 39281183
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3D Models
39281183 - Molex - 3D model - Other - 39281183
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39281183 Details

  • Manufacturer Part Number:

    39281183

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Brazil, India, Japan, Mainland China, Mexico, Puerto Rico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    8

  • Connector Type:

    RECTANGULAR POWER CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Tin (Sn)

  • Contact Material:

    NOT SPECIFIED

  • DIN Conformance:

    NO

  • IEC Conformance:

    NO

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

39281183 Frequently Asked Questions (FAQs)

  • The recommended torque for the screw terminals is 0.5-1.5 Nm (4.4-13.3 in-lbs).
  • Yes, the 39281183 connectors are designed to withstand high-vibration environments, making them suitable for applications such as industrial control systems, automotive, and aerospace.
  • Yes, the connectors are rated for operating temperatures ranging from -40°C to 105°C (-40°F to 221°F) and are suitable for use in harsh environments, including outdoor and high-temperature applications.
  • The maximum wire size that can be used with the 39281183 connectors is 18 AWG (1.0 mm²).
  • Yes, the connectors are designed for automated assembly and can be used with pick-and-place machines and other automated assembly equipment.

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39281183 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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