3BWD-F footprint, schematic symbol and 3D model by Bivar

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PCB Footprints

3D Models

3BWD-F Details

Bivar recommends a thermal pad on the bottom of the device, with a minimum of 2 oz copper and a thermal relief pattern to ensure good heat dissipation.
Use a wire bondable gold wire with a minimum diameter of 0.7 mils, and follow Bivar's recommended wire bonding parameters for optimal results.
The maximum allowable voltage stress on the 3BWD-F is 1.5 times the rated voltage, but this should be avoided to ensure long-term reliability.
Yes, the 3BWD-F is suitable for high-frequency applications up to 1 GHz, but ensure proper PCB layout and decoupling to minimize parasitic effects.
Use a wrist strap or anti-static mat during handling, and consider adding ESD protection devices such as TVS diodes or ESD arrays to the PCB design.

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