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3EZ30D5-TP - MCC

Description: MCC 3EZ18D5-TP View 0 Diodes, Axial Diameter Horizontal Mounting

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Symbol
3EZ30D5-TP - MCC - PCB symbol
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PCB Footprints
3EZ30D5-TP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-15
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3D Models
3EZ30D5-TP - MCC - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-15
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3EZ30D5-TP Details

  • Manufacturer Part Number:

    3EZ30D5-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-15

  • Package Description:

    PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.65

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    16 Ω

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    30 V

  • Reverse Current-Max:

    0.5 µA

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    25 mA

3EZ30D5-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 3EZ30D5-TP can be found in the Micro Commercial Components' application note AN-113, which provides detailed guidelines for PCB layout and land pattern design.
  • The 3EZ30D5-TP has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the component and consider using a heat sink if necessary.
  • The 3EZ30D5-TP has an operating temperature range of -40°C to +125°C, but it's recommended to derate the voltage and current ratings at higher temperatures to ensure reliable operation.
  • The 3EZ30D5-TP is a commercial-grade component, but Micro Commercial Components offers a range of screening options, including burn-in and environmental testing, to meet the requirements of high-reliability and aerospace applications. Contact Micro Commercial Components for more information.
  • The 3EZ30D5-TP is a unique component, but similar devices can be found from other manufacturers, such as the 1N5822 from Vishay Intertechnology or the SR30D5 from Semtech Corporation. However, it's essential to review the datasheets and compare the specifications before selecting an alternative component.

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3EZ30D5-TP Overview

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