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3SMBJ5920B-TP - MCC

Description: Diode Zener Single 6.2V 5% 3W 2-Pin SMB T/R

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Symbol
3SMBJ5920B-TP - MCC - PCB symbol
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PCB Footprints
3SMBJ5920B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)
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3D Models
3SMBJ5920B-TP - MCC - 3D model - Diodes Moulded - SMB (DO-214AA)
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3SMBJ5920B-TP Details

  • Manufacturer Part Number:

    3SMBJ5920B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.2 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    60.5 mA

3SMBJ5920B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5920B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal issues.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Use a solder with a melting point below 240°C, and avoid overheating the component. A well-controlled soldering process and a clean, oxidization-free surface are crucial for a reliable joint.
  • The maximum allowable voltage derating for the 3SMBJ5920B-TP depends on the specific application and environmental conditions. As a general rule, it's recommended to derate the voltage by 10-20% to ensure reliable operation and to account for voltage spikes or transients.
  • The 3SMBJ5920B-TP is designed to operate up to 150°C. However, its performance may degrade at high temperatures. It's essential to consider the component's thermal characteristics, such as thermal resistance and power dissipation, when designing for high-temperature applications.
  • The 3SMBJ5920B-TP is designed for low-frequency applications. While it may be possible to use it in high-frequency applications, its performance may be affected by parasitic inductance and capacitance. It's recommended to consult with a Micro Commercial Components' application engineer or to evaluate the component's performance in a prototype before using it in a high-frequency design.

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3SMBJ5920B-TP Overview

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