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3SMBJ5923B-TP - MCC

Description: Zener Diodes

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PCB Footprints
3SMBJ5923B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)  (LEAD FRAME)
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3SMBJ5923B-TP - MCC  - 3D model - Diodes Moulded - SMB (DO-214AA)  (LEAD FRAME)
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3SMBJ5923B-TP Details

  • Manufacturer Part Number:

    3SMBJ5923B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    3.5 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    400 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    8.2 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    45.7 mA

3SMBJ5923B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5923B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure proper soldering, follow the recommended soldering profile and temperature range specified in the datasheet. Use a solder with a melting point compatible with the component's temperature rating. Avoid overheating, and use a soldering iron with a temperature control. Inspect the solder joints for defects, such as cold solder joints, bridges, or opens.
  • The 3SMBJ5923B-TP has a high power dissipation rating, so it's essential to consider thermal management. Ensure good airflow around the component, and consider using a heat sink or thermal interface material to reduce thermal resistance. Follow the recommended thermal derating curves and ensure the component is operated within the specified temperature range.
  • Handle the 3SMBJ5923B-TP by the body, avoiding touching the leads or the component's surface. Store the component in an anti-static bag or wrap it in anti-static material. Ground yourself before handling the component, and use an anti-static wrist strap or mat. Avoid exposing the component to extreme temperatures, humidity, or physical stress.
  • The 3SMBJ5923B-TP is manufactured according to Micro Commercial Components' quality standards, which include compliance with industry standards such as ISO 9001, IECQ, and AEC-Q101. The component is also qualified according to the automotive industry's AEC-Q101 standard, ensuring high reliability and quality.

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3SMBJ5923B-TP Overview

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