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3SMBJ5930B-TP - MCC

Description: 3.0 Watt Surface Mount Silicon Zener Diodes 5.1V to 200V

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3SMBJ5930B-TP - MCC - PCB symbol
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PCB Footprints
3SMBJ5930B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3D Models
3SMBJ5930B-TP - MCC - 3D model - Diodes Moulded - smb
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3SMBJ5930B-TP Details

  • Manufacturer Part Number:

    3SMBJ5930B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    16 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    23.4 mA

3SMBJ5930B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5930B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal issues.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Use a solder with a melting point below 220°C to prevent damage to the component. Also, ensure the PCB is clean and free of oxidation to promote good solder wetting.
  • The maximum allowable voltage derating for the 3SMBJ5930B-TP is typically 10-15% below the maximum rated voltage. However, it's recommended to consult the datasheet or contact Micro Commercial Components for specific derating guidelines to ensure reliable operation.
  • The 3SMBJ5930B-TP is rated for operation up to 150°C. However, it's essential to consider the derating factors and ensure the component is operated within the recommended temperature range to prevent thermal runaway and ensure reliability.
  • Handle the 3SMBJ5930B-TP by the body, avoiding touching the leads or the glass passivation. Store the components in their original packaging or in a dry, ESD-protected environment to prevent moisture and electrostatic damage.

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3SMBJ5930B-TP Overview

Use the download button to access the 3SMBJ5930B-TP schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for 3SMBJ5930B-TP, check out Findchips.com