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3SMBJ5931B-TP - MCC

Description: Zener Diodes

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3SMBJ5931B-TP - MCC - PCB symbol
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PCB Footprints
3SMBJ5931B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3SMBJ5931B-TP - MCC - 3D model - Diodes Moulded - smb
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3SMBJ5931B-TP Details

  • Manufacturer Part Number:

    3SMBJ5931B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    12 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    650 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20.8 mA

3SMBJ5931B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5931B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure proper soldering and avoid defects, follow the recommended soldering profile and temperature, use a solder with a melting point compatible with the component's rating, and ensure the PCB is clean and free of oxidation. Additionally, use a soldering iron with a temperature control and a flux suitable for the component's package type.
  • The maximum allowable power dissipation for the 3SMBJ5931B-TP is dependent on the ambient temperature and the thermal resistance of the component. According to the datasheet, the maximum power dissipation is 5W at 25°C ambient temperature. However, this value can be derated based on the actual operating temperature and thermal resistance.
  • The 3SMBJ5931B-TP is a commercial-grade component, and its use in high-reliability or aerospace applications may require additional testing and qualification. It is recommended to consult with the manufacturer and relevant industry standards (e.g., MIL-PRF-19500) to ensure the component meets the required specifications and reliability standards.
  • Handle the 3SMBJ5931B-TP by the body, avoiding touching the leads or any electrical contacts. Store the component in an anti-static bag or wrap it in anti-static material, and keep it away from direct sunlight and moisture. Ensure that the storage area is ESD-protected and follow proper ESD handling procedures.

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3SMBJ5931B-TP Overview

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