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3SMBJ5935B-TP - MCC

Description: Zener Diodes

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3SMBJ5935B-TP - MCC - PCB symbol
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PCB Footprints
3SMBJ5935B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3D Models
3SMBJ5935B-TP - MCC - 3D model - Diodes Moulded - smb
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3SMBJ5935B-TP Details

  • Manufacturer Part Number:

    3SMBJ5935B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    23 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    700 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    27 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    13.9 mA

3SMBJ5935B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5935B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure proper soldering and reliability, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a melting point compatible with the component's rating, and ensure the solder joints are visually inspected for quality and integrity.
  • The 3SMBJ5935B-TP has a high power dissipation rating, so thermal management is crucial. Ensure good thermal conductivity between the component and the PCB, use thermal vias if necessary, and consider using a heat sink or thermal interface material to dissipate heat efficiently.
  • The 3SMBJ5935B-TP is rated for high-reliability and high-temperature applications. However, it's essential to review the component's specifications and ensure it meets the specific requirements of your application. Additionally, consider performing environmental and reliability testing to validate the component's performance in your specific use case.
  • The 3SMBJ5935B-TP is sensitive to electrostatic discharge (ESD). Handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process also follow ESD-safe practices to prevent damage during manufacturing and assembly.

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3SMBJ5935B-TP Overview

Use the download button to access the 3SMBJ5935B-TP schematic symbol, PCB footprint, and 3D model.
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