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3SMBJ5939B-TP - MCC

Description: Zener Diodes

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3SMBJ5939B-TP - MCC - PCB symbol
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PCB Footprints
3SMBJ5939B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3D Models
3SMBJ5939B-TP - MCC - 3D model - Diodes Moulded - smb
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3SMBJ5939B-TP Details

  • Manufacturer Part Number:

    3SMBJ5939B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    45 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    900 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    39 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    9.6 mA

3SMBJ5939B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5939B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent damage, handle the 3SMBJ5939B-TP by the body only, avoiding touching the leads or the glass diode. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the leads, and use a pick-and-place machine or a vacuum pickup tool to handle the component during assembly.
  • The maximum allowable voltage derating for the 3SMBJ5939B-TP is typically 10-15% below the maximum rated voltage. However, it is recommended to consult the datasheet or contact Micro Commercial Components for specific derating guidelines, as excessive derating can affect the component's reliability and performance.
  • The 3SMBJ5939B-TP is rated for operation up to 150°C. However, it is essential to consider the component's power dissipation, thermal resistance, and the PCB's thermal design when operating in high-temperature environments. Consult the datasheet and perform thermal analysis to ensure the component operates within its specified limits.
  • To ensure proper soldering and reliability, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point above 217°C, and ensure the solder joints meet the IPC-A-610 standards. Also, perform visual inspection, X-ray inspection, or other reliability tests to verify the solder joints meet the required standards.

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3SMBJ5939B-TP Overview

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