Bivar recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
To ensure reliable soldering, Bivar recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. The component should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
The 3SRC-F is designed to withstand a maximum voltage stress of 1.5 times the rated voltage for a duration of 1 second. Exceeding this voltage stress may lead to device failure or reduced lifespan.
While the 3SRC-F is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance and reliability may be affected by high-frequency operation, and additional testing and validation may be required.
Bivar recommends storing the 3SRC-F in a dry, cool place away from direct sunlight and moisture. The devices should be stored in their original packaging or in a similar protective package to prevent mechanical damage and electrostatic discharge (ESD).
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3SRC-F Overview
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