Bivar recommends a PCB layout with a solid ground plane and a thermal relief pattern to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the device should be mounted on a heat sink with a thermal interface material.
To ensure reliable operation in high-vibration environments, Bivar recommends using a secure mounting method, such as screwing or adhesive bonding, and ensuring that the device is properly secured to the PCB. Additionally, using a conformal coating can help protect the device from vibration-induced damage.
The maximum allowable lead temperature during soldering is 260°C (500°F) for a maximum of 10 seconds. Exceeding this temperature or time can cause damage to the device.
While the 3YDL-F is not hermetically sealed, it can operate in humid environments. However, Bivar recommends using a conformal coating and ensuring good PCB design practices to minimize the risk of moisture ingress. Operating in extremely humid environments may require additional protection measures.
Bivar recommends storing the 3YDL-F in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Handling should be done with anti-static precautions, and the device should be kept away from mechanical stress and vibration.
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3YDL-F Overview
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