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42TM114-RC - Xicon

Description: Audio Transformers / Signal Transformers XFMR IMP 4.6K/20

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PCB Footprints
42TM114-RC - Xicon PCB footprint - Other - Other - 42TM114-RC-1
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42TM114-RC - Xicon  - 3D model - Other - 42TM114-RC-1
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42TM114-RC Details

  • Manufacturer Part Number:

    42TM114-RC

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Xicon Passive Components

  • Application:

    GENERAL PURPOSE

  • Height:

    16.99 mm

  • Length:

    22 mm

  • Mounting Feature:

    THROUGH HOLE MOUNTED

  • Operating Frequency-Max:

    3.4 kHz

  • Operating Frequency-Min:

    0.3 kHz

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -30 °C

  • Secondary Impedance:

    20 OHMS

  • Surface Mount:

    NO

  • Transformer Type:

    GENERAL PURPOSE AUDIO TRANSFORMER

  • Width:

    16.99 mm

42TM114-RC Frequently Asked Questions (FAQs)

  • The recommended soldering temperature profile for the 42TM114-RC is a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a ramp-up rate of 3°C/s (5.4°F/s) and a ramp-down rate of 6°C/s (10.8°F/s).
  • While the 42TM114-RC is a general-purpose resistor network, it's not optimized for high-frequency applications. For frequencies above 100 MHz, it's recommended to use a high-frequency resistor network or consider other components specifically designed for high-frequency use.
  • The 42TM114-RC is rated for operation up to 155°C (311°F). While it can tolerate high temperatures, it's essential to ensure that the component is properly derated to prevent overheating and premature failure. Consult the datasheet and relevant application notes for guidance on temperature derating.
  • The 42TM114-RC has an MSL rating of 1, which means it can withstand normal humidity and temperature conditions without requiring special handling or storage. However, it's still important to follow proper storage and handling procedures to prevent damage.
  • When designing the PCB layout, ensure that the component is placed on a solid ground plane to minimize thermal resistance and electromagnetic interference (EMI). Also, maintain a minimum clearance of 0.5 mm (0.02 inches) between the component and any adjacent components or conductive paths.

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42TM114-RC Overview

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