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4308H-102-332LF - Bourns

Description: Resistor Networks & Arrays THK FILM MOLD SIP 3.3K 2%

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4308H-102-332LF - Bourns PCB footprint - Other - Other - 4308H-102-332LF-1
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4308H-102-332LF - Bourns  - 3D model - Other - 4308H-102-332LF-1
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4308H-102-332LF Details

  • Manufacturer Part Number:

    4308H-102-332LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SIP, ROHS COMPLIANT

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Costa Rica

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.15

  • Construction:

    Molded

  • Element Power Dissipation:

    0.5 W

  • First Element Resistance:

    3300 Ω

  • JESD-609 Code:

    e3

  • Lead Length:

    3.43 mm

  • Lead Spacing:

    2.54 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    8.89 mm

  • Package Length:

    19.91 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SIP

  • Package Width:

    2.16 mm

  • Rated Power Dissipation (P):

    1.6 W

  • Rated Temperature:

    70 °C

  • Resistance:

    3300 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Size Code:

    7808

  • Surface Mount:

    NO

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Temperature Coefficient Tracking:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    FLAT

  • Tolerance:

    2%

  • Working Voltage:

    100 V

4308H-102-332LF Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure proper thermal management, signal integrity, and mechanical stability.
  • To handle the high current rating, ensure that your PCB traces and vias are designed to handle the maximum current rating. Use thick copper traces, and consider using multiple vias to reduce thermal resistance. Also, ensure that your power supply and other components can handle the high current demand.
  • The operating temperature range for the 4308H-102-332LF is -40°C to +125°C. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures. Consult the datasheet and application notes for more information on temperature-related specifications.
  • Follow the recommended soldering profile and assembly guidelines provided by Bourns. Ensure that the PCB is clean and free of contaminants, and use a soldering iron with a temperature range of 250°C to 260°C. Avoid applying excessive force or pressure during assembly, as this can damage the device.
  • The 4308H-102-332LF is a sensitive device and requires proper ESD protection during handling and assembly. Use ESD-safe materials, such as wrist straps, mats, and bags, and follow proper handling procedures to prevent damage from electrostatic discharge.

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4308H-102-332LF Overview

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