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43650-1026 - Molex

Description: Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 10 Circuits, with Solder Tab

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PCB Footprints
43650-1026 - Molex PCB footprint - Other - Other - 43650-10YY_242526
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3D Models
43650-1026 - Molex  - 3D model - Other - 43650-10YY_242526
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43650-1026 Details

  • Manufacturer Part Number:

    43650-1026

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    8

  • Body Breadth:

    0.219 inch

  • Body Depth:

    0.39 inch

  • Body Length:

    1.325 inch

  • Body/Shell Style:

    PLUG

  • Connector Type:

    RECTANGULAR POWER CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    MATTE TIN OVER NICKEL

  • Contact Gender:

    MALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Style:

    SQ PIN-SKT

  • DIN Conformance:

    NO

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • Insulator Material:

    GLASS FILLED LIQUID CRYSTAL POLYMER

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Style:

    STRAIGHT

  • Mounting Type:

    BOARD

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    10

  • UL Flammability Code:

    94V-0

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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Community Approved
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43650-1026 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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