Power Dynamics Inc recommends a 4-layer PCB with a dedicated ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the power traces. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal interface material.
To ensure reliable operation in high-vibration environments, Power Dynamics Inc recommends securing the device to the PCB using a combination of screws and adhesive. Additionally, the PCB should be designed to minimize flexure and the device should be located away from vibration sources.
Power Dynamics Inc recommends derating the device's power output by 1% per degree Celsius above 50°C. For example, at 70°C, the device's power output should be derated by 20% to ensure reliable operation.
Yes, the 44R02-2121-250 can be used in a redundant or parallel configuration to increase power output or improve system reliability. However, Power Dynamics Inc recommends consulting with their application engineers to ensure proper design and implementation.
The 44R02-2121-250 is designed to meet CISPR 22 Class B emissions standards. To minimize EMI and RFI, Power Dynamics Inc recommends using a shielded enclosure, keeping the device away from sensitive circuits, and using EMI filters on the input and output lines.
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44R02-2121-250 Overview
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