46103C - Murata Electronics

46103C Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the 46103C?
  The recommended land pattern for the 46103C is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
• How do I handle the 46103C's sensitivity to moisture?
  To handle the 46103C's sensitivity to moisture, it is recommended to store the components in a dry environment (less than 20% RH) and to bake the components at 125°C for 24 hours before reflow soldering. Additionally, the components should be soldered within 168 hours of opening the package.
• What is the maximum reflow temperature for the 46103C?
  The maximum reflow temperature for the 46103C is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. The recommended reflow profile is a ramp-up rate of 3°C/s, a soak temperature of 220°C for 30 seconds, and a cool-down rate of 6°C/s.
• Can the 46103C be used in high-vibration applications?
  Yes, the 46103C is designed to withstand high-vibration applications. It has a vibration resistance of 10G (10-2000Hz) and a shock resistance of 100G (11ms). However, it is recommended to perform additional testing and validation to ensure the component meets the specific requirements of the application.
• What is the recommended cleaning process for the 46103C?
  The recommended cleaning process for the 46103C is a mild cleaning process using a mixture of 70% isopropyl alcohol and 30% deionized water. Ultrasonic cleaning is not recommended, and the use of chlorinated or fluorinated solvents should be avoided.