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5.0SMDJ16CAS - LITTELFUSE

Description: The 5.0SMDJxxS series, single chip design is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events, Bi-directional

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PCB Footprints
5.0SMDJ16CAS - LITTELFUSE PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - DO-214AB (SMC J-BEND) -2020
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3D Models
5.0SMDJ16CAS - LITTELFUSE  - 3D model - Diodes Moulded Non Polarised - DO-214AB (SMC J-BEND) -2020
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5.0SMDJ16CAS Details

  • Manufacturer Part Number:

    5.0SMDJ16CAS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    19.7 V

  • Breakdown Voltage-Min:

    17.8 V

  • Breakdown Voltage-Nom:

    18.75 V

  • Clamping Voltage-Max:

    26 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    5000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Reference Standard:

    IEC-61000-4-2, 4-4; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    16 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    16 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

5.0SMDJ16CAS Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 5.0SMDJ16CAS is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm solder mask clearance.
  • Yes, the 5.0SMDJ16CAS is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated for temperature to avoid overheating.
  • For reflow soldering, it's recommended to use a peak temperature of 260°C for 20-30 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. Ensure that the device is properly centered on the PCB and that the solder paste is evenly distributed.
  • Yes, the 5.0SMDJ16CAS is compatible with lead-free soldering. It's designed to meet the requirements of the RoHS directive and can be used with lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • The typical response time of the 5.0SMDJ16CAS is less than 1ns, making it suitable for high-speed applications. However, the actual response time may vary depending on the specific application and PCB layout.

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5.0SMDJ16CAS Overview

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