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5.0SMLJ60A-TP - MCC

Description: TVS

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5.0SMLJ60A-TP - MCC - PCB symbol
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PCB Footprints
5.0SMLJ60A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMC (DO-214AB)
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3D Models
5.0SMLJ60A-TP - MCC - 3D model - Diodes Moulded - SMC (DO-214AB)
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5.0SMLJ60A-TP Details

  • Manufacturer Part Number:

    5.0SMLJ60A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    8

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    73.7 V

  • Breakdown Voltage-Min:

    66.7 V

  • Breakdown Voltage-Nom:

    70.2 V

  • Clamping Voltage-Max:

    96.8 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    5 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    5000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

5.0SMLJ60A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 5.0SMLJ60A-TP can be found in the manufacturer's application note or on the company's website. Typically, a standard SOD-323 footprint with a 0.65mm x 0.65mm pad size is recommended.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 260°C, and avoid excessive soldering temperatures or times. Inspect the solder joints for defects, such as cold solder joints, bridges, or opens.
  • The maximum operating temperature range for the 5.0SMLJ60A-TP is -65°C to 150°C. However, the device's electrical characteristics may degrade above 125°C, so it's essential to consider the application's temperature requirements.
  • The 5.0SMLJ60A-TP is a commercial-grade device, and its use in high-reliability or aerospace applications may require additional testing and qualification. It's recommended to consult with the manufacturer or a qualified reliability engineer to determine the device's suitability for such applications.
  • Handle the 5.0SMLJ60A-TP with ESD-protective materials, such as wrist straps, mats, or bags. Store the devices in their original packaging or in a conductive container to prevent ESD damage. Follow proper ESD handling and storage procedures to prevent damage.

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5.0SMLJ60A-TP Overview

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