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501786-4080 - Molex

Description: 0.50mm Pitch Easy-On FFC-to-Board Connector, Receptacle Housing Assembly, Vertical, Surface Mount, with Grounding Terminals, Separated Gold (Au) Plating, Circuits

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PCB Footprints
501786-4080 - Molex PCB footprint - Other - Other - 501786-4080-5
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3D Models
501786-4080 - Molex  - 3D model - Other - 501786-4080-5
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501786-4080 Details

  • Manufacturer Part Number:

    501786-4080

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, South Korea

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    6.57

  • Additional Feature:

    TAPE AND REEL

  • Board Mounting Option:

    PEG

  • Body Breadth:

    0.179 inch

  • Body Depth:

    0.293 inch

  • Body Length:

    1.106 inch

  • Connector Type:

    FFC/FPC CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Tin/Bismuth (Sn/Bi)

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Style:

    BELLOWED TYPE

  • Filter Feature:

    NO

  • Insulator Color:

    BLACK

  • Insulator Material:

    GLASS FILLED LIQUID CRYSTAL POLYMER

  • JESD-609 Code:

    e6

  • Mating Contact Pitch:

    0.020 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    STRAIGHT

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    1

  • Number of Rows Loaded:

    1

  • PCB Contact Pattern:

    RECTANGULAR

  • Reference Standard:

    UL

  • Terminal Pitch:

    0.508 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    40

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501786-4080 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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