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54550-1971 - Molex

Description: FFC & FPC Connectors 0.5 FPC ZIF Hsg Assy ssy 19Ckt EmbsTp Pkg

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PCB Footprints
54550-1971 - Molex PCB footprint - Other - Other - 54550-1971-2
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3D Models
54550-1971 - Molex  - 3D model - Other - 54550-1971-2
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54550-1971 Details

  • Manufacturer Part Number:

    54550-1971

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Molex

  • YTEOL:

    0

  • Board Mounting Option:

    FITTING NAIL

  • Body Breadth:

    0.047 inch

  • Body Depth:

    0.151 inch

  • Body Length:

    0.579 inch

  • Connector Type:

    FFC/FPC CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    NOT APPLICABLE

  • Contact Gender:

    FEMALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    40 mΩ

  • Contact Style:

    BELLOWED TYPE

  • Filter Feature:

    NO

  • Insulation Resistance:

    50000000 Ω

  • Insulator Material:

    LIQUID CRYSTAL POLYMER

  • Mating Contact Pitch:

    0.020 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    1

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PCB Contact Pattern:

    RECTANGULAR

  • Polarization Key:

    POLARIZED HOUSING

  • Rated Current (Signal):

    0.5 A

  • Reference Standard:

    UL

  • Terminal Pitch:

    0.5 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    19

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54550-1971 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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