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5962-3829408MXA - Renesas Electronics

Description: The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation.

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5962-3829408MXA - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - CD28-_-1
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5962-3829408MXA Details

  • Manufacturer Part Number:

    5962-3829408MXA

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    CERAMIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    CD28

  • Country Of Origin:

    USA

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    55 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-GDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    60.96 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    8KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    38535Q/M;38534H;883B

  • Seated Height-Max:

    4.826 mm

  • Standby Current-Max:

    0.0003 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.105 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

5962-3829408MXA Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the core voltage (VCC) before the input/output voltage (VIO).
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1 μF to 1 μF, placed as close as possible to the device's power pins. The exact capacitor values and placement can be found in the device's datasheet or application notes.
  • To ensure clock signal integrity and minimize jitter, Renesas recommends using a high-quality clock source, such as a crystal oscillator or a low-jitter clock generator. Additionally, the clock signal should be routed as a differential pair, and the PCB layout should be designed to minimize noise and coupling.
  • Renesas provides thermal design guidelines in their datasheet and application notes. Key considerations include thermal resistance, junction temperature, and heat sink design. Engineers should also consider the device's power consumption, ambient temperature, and airflow when designing the thermal management system.

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5962-3829408MXA Overview

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