5ASXBB5D4F31I5G - Intel

5ASXBB5D4F31I5G Details

• Manufacturer Part Number:

  5ASXBB5D4F31I5G

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Country Of Origin:

  Mainland China, Malaysia, Taiwan, USA, Vietnam

• ECCN Code:

  3A991

• HTS Code:

  8542.39.00.01

• Manufacturer:

  Intel Corporation

• JESD-30 Code:

  S-PBGA-B896

• Length:

  31 mm

• Number of Terminals:

  896

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HBGA

• Package Equivalence Code:

  BGA896,30X30,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, HEAT SINK/SLUG

• Seated Height-Max:

  2.7 mm

• Supply Voltage-Max:

  1.13 V

• Supply Voltage-Min:

  1.07 V

• Supply Voltage-Nom:

  1.1 V

• Surface Mount:

  YES

• Technology:

  TSMC

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  31 mm

• uPs/uCs/Peripheral ICs Type:

  SoC FPGA