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5PB1104PGGI - Renesas Electronics

Description: The 5PB1104 is a high-performance 1:4 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50 fsec RMS. The 5PB1104 also supports an Output Enable function. It is available in 8-pin DFN and TSSOP packages and can operate from a 1.8 V to 3.3 V supply. 

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5PB1104PGGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8PIN TSSOP*+-+
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5PB1104PGGI - Renesas Electronics  - 3D model - Small Outline Packages - 8PIN TSSOP*+-+
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5PB1104PGGI Details

  • Manufacturer Part Number:

    5PB1104PGGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    8

  • Manufacturer Package Code:

    PGG8D1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    5PB11

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    22 mA

  • Prop. Delay@Nom-Sup:

    2.5 ns

  • Propagation Delay (tpd):

    2.9 ns

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

5PB1104PGGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust power-on reset circuit, ensure a stable clock signal, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a minimum of 2-3 decoupling capacitors (10uF, 100nF, and 10nF) placed close to the device, with a low-ESR capacitor (10uF) connected directly to the power pins. Bypass capacitors should be placed near the device's power pins.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters or common-mode chokes on I/O lines. Follow the recommended PCB layout and routing guidelines to minimize emissions.
  • Ensure a slow and controlled power ramp-up (typically 1-10 ms) to prevent damage. Use a power sequencer or a soft-start circuit to control the power supply voltage.

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