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670MI-02LF - Renesas Electronics

Description: The ICS670-02 is a high speed, low phase noise, Zero Delay Buffer (ZDB) which integrates IDT’s proprietary analog/digital Phase Locked Loop (PLL) techniques. Part of IDT’s ClockBlocksTM family, the part’s zero delay feature means that the rising edge of the input clock aligns with the rising edges of the outputs giving the appearance of no delay through the device. There are two identical outputs on the chip. The FBCLK should be used to connect to the FBIN. Each output has its own output enable pin. The ICS

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670MI-02LF - Renesas Electronics - PCB symbol
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670MI-02LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DCG16--ren1
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670MI-02LF - Renesas Electronics - 3D model - Small Outline Packages - DCG16--ren1
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670MI-02LF Details

  • Manufacturer Part Number:

    670MI-02LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    DCG16

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    670

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    160 MHz

670MI-02LF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN2732EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a fuse or a dedicated overcurrent protection IC, to prevent damage to the device. The datasheet provides guidelines for selecting the appropriate overcurrent protection component.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, Renesas recommends operating the device within a range of -20°C to 85°C for optimal performance and reliability.
  • Renesas provides EMC design guidelines in their application note (R01AN2732EU0100), which include recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with relevant EMC standards.
  • Renesas recommends storing the 670MI-02LF in a dry, cool place with a temperature range of -20°C to 40°C to prevent damage or degradation of the device.

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670MI-02LF Overview

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670MI-02LF Alternates

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