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6ED003L02F2XUMA1 - Infineon

Description: Infineon 6ED003L02F2XUMA1 Hex Galvanic Isolated MOSFET Power Driver, 240mA 28-Pin, TSSOP

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6ED003L02F2XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-28
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6ED003L02F2XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-28
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6ED003L02F2XUMA1 Details

  • Manufacturer Part Number:

    6ED003L02F2XUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-28

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.42 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    17.5 V

  • Supply Voltage-Min:

    13 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    17.5 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SOI-CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.76 µs

  • Turn-on Time:

    0.8 µs

  • Width:

    4.4 mm

6ED003L02F2XUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, the device should be operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • The 6ED003L02F2XUMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and testing. A minimum of HBM (Human Body Model) 2kV and MM (Machine Model) 200V ESD protection is recommended.
  • Yes, the 6ED003L02F2XUMA1 is suitable for high-reliability and safety-critical applications. However, it's essential to follow Infineon's guidelines for functional safety and to consult the device's FMEDA (Failure Mode Effects and Diagnostic Analysis) report.
  • Infineon recommends following the JEDEC J-STD-020 standard for soldering conditions. The recommended peak reflow temperature is 260°C, with a maximum of 3 reflow cycles.

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