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6ED003L06F2XUMA1 - Infineon

Description: Infineon 6ED003L06F2XUMA1 Hex Galvanic Isolated MOSFET Power Driver, 420mA 28-Pin, DSO

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6ED003L06F2XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-28
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6ED003L06F2XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-28
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6ED003L06F2XUMA1 Details

  • Manufacturer Part Number:

    6ED003L06F2XUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-28

  • Country Of Origin:

    Indonesia, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.42 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    17.5 V

  • Supply Voltage-Min:

    13 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    17.5 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SOI-CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.76 µs

  • Turn-on Time:

    0.8 µs

  • Width:

    7.5 mm

6ED003L06F2XUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capabilities at high temperatures.
  • The device has internal ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag or container.
  • Yes, but ensure you follow Infineon's guidelines for high-reliability applications, including using the device within its recommended operating conditions, and implementing proper fault detection and handling mechanisms.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, decoupling, and PCB layout for any issues. Consult Infineon's application notes and technical support resources for guidance.

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6ED003L06F2XUMA1 Overview

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