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6EDL04I06PT - Infineon

Description: 3 phase 200 V and 600 V gate drive IC, DSO28

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PCB Footprints
6EDL04I06PT - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO28
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3D Models
6EDL04I06PT - Infineon  - 3D model - Small Outline Packages - PG-DSO28
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6EDL04I06PT Details

  • Manufacturer Part Number:

    6EDL04I06PT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    28

  • Country Of Origin:

    Indonesia, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.42 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    17.5 V

  • Supply Voltage-Min:

    13 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    17.5 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.76 µs

  • Turn-on Time:

    0.8 µs

  • Width:

    7.5 mm

6EDL04I06PT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
  • The 6EDL04I06PT has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag.
  • Yes, the 6EDL04I06PT is designed for high-reliability applications. However, it's essential to follow Infineon's guidelines for functional safety and to perform thorough testing and validation for your specific application.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and time above 200°C 60s. Use a solder with a melting point above 217°C.

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6EDL04I06PT Overview

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