70T3319S166BFG - Renesas Electronics

70T3319S166BFG Details

• Manufacturer Part Number:

  70T3319S166BFG

• Brand Name:

  Renesas

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  CABGA

• Pin Count:

  208

• Manufacturer Package Code:

  BFG208

• ECCN Code:

  3A991.B.2.A

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Renesas Electronics Corporation

• YTEOL:

  0

• Access Time-Max:

  3.6 ns

• Additional Feature:

  FLOW-THROUGH OR PIPELINED ARCHITECTURE

• Clock Frequency-Max (fCLK):

  166 MHz

• I/O Type:

  COMMON

• JESD-30 Code:

  S-CBGA-B208

• JESD-609 Code:

  e1

• Length:

  15 mm

• Memory Density:

  4718592 bit

• Memory IC Type:

  MULTI-PORT SRAM

• Memory Width:

  18

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Ports:

  2

• Number of Terminals:

  208

• Number of Words:

  262144 words

• Number of Words Code:

  256000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  256KX18

• Output Characteristics:

  3-STATE

• Package Body Material:

  CERAMIC, METAL-SEALED COFIRED

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA208,17X17,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.7 mm

• Standby Current-Max:

  0.015 A

• Standby Voltage-Min:

  2.4 V

• Supply Current-Max:

  0.45 mA

• Supply Voltage-Max (Vsup):

  2.6 V

• Supply Voltage-Min (Vsup):

  2.4 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  15 mm