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70T3539MS133BCI - Renesas Electronics

Description: The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.

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70T3539MS133BCI - Renesas Electronics PCB footprint - BGA - BGA - BC256
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70T3539MS133BCI Details

  • Manufacturer Part Number:

    70T3539MS133BCI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BC256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    15 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Current-Max:

    0.025 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

70T3539MS133BCI Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 70T3539MS133BCI is -40°C to 125°C.
  • The POR sequence for the 70T3539MS133BCI involves applying power to the device, waiting for the internal voltage regulator to stabilize, and then releasing the reset signal. Refer to the datasheet for specific timing requirements.
  • The maximum clock frequency supported by the 70T3539MS133BCI is 133 MHz.
  • To configure the 70T3539MS133BCI for low-power operation, use the power management registers to control clock gating, voltage scaling, and sleep modes. Refer to the datasheet for specific register settings and power-saving techniques.
  • The maximum current consumption of the 70T3539MS133BCI varies depending on the operating frequency and voltage. Refer to the datasheet for specific current consumption values under different operating conditions.

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